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English
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For å registrere i Cristin må du være vitenskapelig eller administrativt ansatt.
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2017
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1. |
Schjølberg-Henriksen, Kari; Gjessing, Jo; Bakke, Kari Anne Hestnes; Hadzialic, Sanja; Wang, Dag Thorstein. Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding. Photonics West - OPTO; 2017-01-27 - 2017-02-01 SINTEF
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2. |
Schjølberg-Henriksen, Kari; Gjessing, Jo; Bakke, Kari Anne Hestnes; Hadzialic, Sanja; Wang, Dag Thorstein. Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding. I: Silicon Photonics XII. SPIE - International Society for Optical Engineering 2017 ISBN 9781510606579. SINTEF
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2016
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3. |
Poppe, Erik Utne; Jensen, Geir Uri; Moe, Sigurd T.; Wang, Dag Thorstein. Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding. PRiME 2016; 2016-10-02 - 2016-10-07 SINTEF
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4. |
Poppe, Erik Utne; Jensen, Geir Uri; Moe, Sigurd T.; Wang, Dag Thorstein. Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding. ECS Transactions 2016 ;Volum 75.(9) s. 311-319 SINTEF
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2015
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5. |
Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik; Wang, Dag Thorstein. Conductivity of high-temperature annealed silicon direct wafer bonds. Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems 2015 ;Volum 21.(5) s. 979-985 USN SINTEF
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2014
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6. |
Johansen, Ib-Rune; Bakke, Thor; Wang, Dag Thorstein; Herbjørnrød, Aina Kristin; Jensen, Geir Uri; Summanwar, Anand; Bjor, Ole-Herman; Kaspersen, Peter; Dang, Dung Do; Geiser, Peter. Highly sensitive MEMS microphone with optical readout. Norwegian electro - optics meeting 2014; 2014-04-23 - 2014-04-25 SINTEF
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7. |
Lacolle, Matthieu Jean P; Johansen, Ib-Rune; Bakke, Thor; Wang, Dag Thorstein; Herbjørnrød, Aina Kristin; Jensen, Geir Uri; Summanwar, Anand; Bjor, Ole-Herman; Kaspersen, Peter; Dang, Dung Do; Geiser, Peter. Highly sensitive MEMS microphone with optical readout. Norwegian electro - optics meeting 2014; 2014-04-23 - 2014-04-25 SINTEF
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8. |
Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik; Wang, Dag Thorstein. Bond strength of conductive Si-Si fusion bonded seals. DTIP; 2014-04-01 - 2014-04-04 USN SINTEF
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9. |
Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Moe, Sigurd T.; Poppe, Erik; Wang, Dag Thorstein; Gjelstad, Stein Are; Mørk, Christopher; Imenes, Kristin. Bond strength of conductive Si-Si bonded seals. I: Symposium on Design, test, Integration & Packaging of MEMS/MOEMS, Cannes, France, 1-4 April, 2014. EDA Publishing Association 2014 ISBN 9782355000287. s. 312-317 USN SINTEF
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2013
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10. |
Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Gjelstad, Stein Are; Mørk, Christopher; Moe, Sigurd T.; Imenes, Kristin; Poppe, Erik; Wang, Dag Thorstein. Conductive hydrophilic and hydrophobic high-temperature silicon direct wafer bonding. WaferBond'13; 2013-12-05 - 2013-12-06 USN SINTEF
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2012
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11. |
Due-Hansen, Jon; Midtbø, Kjersti; Poppe, Erik; Summanwar, Anand; Jensen, Geir Uri; Breivik, Lars; Wang, Dag Thorstein; Schjølberg-Henriksen, Kari. Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias. Journal of Micromechanics and Microengineering (JMM) 2012 ;Volum 22.(7) s. - SINTEF NTNU
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12. |
Lacolle, Matthieu Jean P; Johansen, Ib-Rune; Wang, Dag Thorstein; Moe, Sigurd T.; Sagberg, Håkon; Clausen, Sigmund; Karlsson, Arne; Akporiaye, Duncan. Fabrication of an array of silicon microscales for the monitoring of chemical processes. Journal of Micromechanics and Microengineering (JMM) 2012 ;Volum 22.(7) s. - SINTEF
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13. |
Midtbø, Kjersti; Due-Hansen, Jon; Poppe, Erik; Rønnekleiv, Arne; Wang, Dag Thorstein; Ingebrigtsen, Kjell A.; Jensen, Geir Uri; Schjølberg-Henriksen, Kari. High-frequency CMUT Arrays with Phase-steering for in vivo Ultrasound Imaging. IEEE Sensors; 2012-10-28 - 2012-10-31 NTNU SINTEF
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14. |
Midtbø, Kjersti; Rønnekleiv, Arne; Ingebrigtsen, Kjell A.; Due-Hansen, Jon; Poppe, Erik; Wang, Dag Thorstein; Jensen, Geir Uri; Schjølberg-Henriksen, Kari. High-frequency CMUT Arrays with Phase-steering for in vivo Ultrasound Imaging. I: IEEE sensors 2012, October 28-31, 2012, Taipei, Taiwan, Proceedings. IEEE conference proceedings 2012 ISBN 978-1-4577-1765-9. s. 826-829 NTNU SINTEF
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15. |
Nguyen-Dinh, An; Wang, Dag Thorstein; Meynier, Cyril; Tyholdt, Frode; Vogl, Andreas; Tofteberg, Hannah Karin Kristin Rosquist; Østbø, Niels Peter; Flesch, E. pMUT for high intensity focused ultrasound. I: 2012 IEEE International Ultrasonics Symposium (IUS), Dresden, 7-10 Oct. 2012. IEEE conference proceedings 2012 ISBN 978-1-4673-4561-3. s. 1 --5 SINTEF
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16. |
Nguyen-Dinh, An; Wang, Dag Thorstein; Meynier, Cyril; Vogl, Andreas; Tofteberg, Hannah Rosquist; Østbø, Niels Peter; Flesch, E. pMUT for high intensity focused ultrasound. International Ultrasonics Symposium (IUS); 2012-10-07 - 2012-10-10 SINTEF
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17. |
Petricca, Luca; Ohlckers, Per; Wang, Dag Thorstein. Comsol models of two different microphones membrane with a piezoresistive sensing element. I: Proceedings of the 23rd MicroMechanics and Microsystems Europe Workshop, September 9-12, Ilmenau, Germany (MME2012). Ilmenau: Ilmenau University of Technology 2012 ISBN 978-3-938843-71-0. s. - USN SINTEF
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2011
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18. |
Clausen, Ingelin; Moe, Sigurd T.; Tvedt, Lars Geir Whist; Vogl, Andreas; Wang, Dag Thorstein. A miniaturized pressure sensor with inherent biofouling protection designed for in vivo applications. IEEE Engineering in Medicine and Biology Society. Conference Proceedings 2011 s. 1880-1883 SINTEF
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19. |
Due-Hansen, Jon; Midtbø, Kjersti; Poppe, Erik; Summanwar, Anand; Jensen, Geir Uri; Breivik, Lars; Wang, Dag Thorstein. CMUT ARRAYS WITH POLYSILICON BOTTOM ELECTRODES AND NANO-METER PRECISION CAVITY GAPS. MicroMechanics Europe; 2011-06-19 - 2011-06-22 NTNU SINTEF
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20. |
Vogl, Andreas; Wang, Dag Thorstein. Modelling of piezoelectric micromachined ultrasound transducers (pMUT) for medical use. 2nd International Workshop on Piezoelectric MEMS; 2011-09-06 - 2011-09-07 SINTEF
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2010
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21. |
Bakke, Thor; Vogl, Andreas; Zero, Oleg; Tyholdt, Frode; Johansen, Ib-Rune; Wang, Dag Thorstein. A novel ultra-planar, long-stroke and low-voltage piezoelectric micromirror. Journal of Micromechanics and Microengineering (JMM) 2010 ;Volum 20.(6) s. - SINTEF NTNU
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22. |
Clausen, Ingelin; Seeberg, Trine Margrethe; Gheorghe, Codin; Wang, Dag Thorstein. Biofouling on Protective Coatings for Implantable MEMS. IEEE Sensors Journal 2010 s. 751-754 SINTEF
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23. |
Lacolle, Matthieu Jean P; Bakke, Thor; Wang, Dag Thorstein; Jensen, Geir Uri; Tofteberg, Hannah Rosquist; Breivik, Lars; Johansen, Ib-Rune. Micromachined optical microphone based on a modulated diffractive lens. Norwegian electrooptics meeting 2010; 2010-04-07 - 2010-04-09 SINTEF
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24. |
Midtbø, Kjersti; Rønnekleiv, Arne; Due-Hansen, Jon; Poppe, Erik; Wang, Dag Thorstein; Jensen, Geir Uri. Wafer-bonded CMUTs with through-wafer electrical vias design for immersed applications. 9TH INTERNATIONAL WORKSHOP ON MICROMACHINED ULTRASONIC TRANSDUCERS; 2010-05-20 - 2010-05-21 NTNU SINTEF
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25. |
Tyholdt, Frode; Bakke, Thor; Vogl, Andreas; Poppe, Erik; Tofteberg, Hannah Rosquist; Østbø, Niels Peter; Haavik, Camilla; Wang, Dag Thorstein. SINTEF moveMEMS – a standard process for piezoelectric microsystems prototyping. Electroceramics XII; 2010-06-13 - 2010-06-16 SINTEF
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2009
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26. |
Lacolle, Matthieu Jean P; Bakke, Thor; Wang, Dag Thorstein; Jensen, Geir Uri; Tofteberg, Hannah Rosquist; Breivik, Lars; Johansen, Ib-Rune. Micromachined optical microphone based on a modulated diffractive lens. 3rd of the EOS Topical Meeting on Optical Microsystems (OµS’09); 2009-09-27 - 2009-09-30 SINTEF
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27. |
Tyholdt, Frode; Vogl, Andreas; Poppe, Erik; Tofteberg, Hannah Rosquist; Østbø, Niels Peter; Bakke, Thor; Mielnik, Michal Marek; Haavik, Camilla; Wang, Dag Thorstein. Commercial prototyping of piezoelectric microsystems. E-MRS 2009; 2009-06-08 - 2009-06-12 SINTEF
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28. |
Tyholdt, Frode; Vogl, Andreas; Poppe, Erik; Østbø, Niels Peter; Wang, Dag Thorstein. SINTEF moveMEMS – piezoelectric microsystems for industry. Nanotech Europe 2009; 2009-09-28 - 2009-09-30 SINTEF
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29. |
Vogl, Andreas; Wang, Dag Thorstein; Storås, Preben; Bakke, Thor; Taklo, Maaike Margrete Visser; Thomson, Allan; Balgård, Lennart. Design, process and characterisation of a high-performance vibration sensor for wireless condition monitoring. Sensors and Actuators A-Physical 2009 ;Volum 153.(2) s. 155-161 SINTEF
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30. |
Wang, Dag Thorstein; Schjølberg-Henriksen, Kari. Application-specific Smart System Integration. EPoSS General Assembly and Annual Forum 2009; 2009-10-08 - 2009-10-09 SINTEF
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2008
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31. |
Schjølberg-Henriksen, Kari; Schulz, Olaf; Ferber, Alain Marc C; Moe, Sigurd T.; Lloyd, Martin; Muller, Gerhard; Suphan, Karl-Heinz; Wang, Dag Thorstein; Bernstein, Ralph W.. Sensitive and Selective Photoacoustic Gas Sensor Suitable for High-Volume Manufacturing. IEEE Sensors Journal 2008 ;Volum 8.(9-10) s. 1539-1545 SINTEF NTNU
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2006
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32. |
Schjølberg-Henriksen, Kari; Ferber, Alain Marc C; Moe, Sigurd T.; Wang, Dag Thorstein; Bernstein, Ralph W.; Rogne, Henrik; Schulz, O.; Lloyd, M.; Suphan, K.-H.; Müller, G.. Sensitive and Selective Photo Acoustic Gas Sensor Suitable for High Volume Manufacturing. I: 5th IEEE Conference on Sensors, 2006. : IEEE 2006 ISBN 1424403766. s. 679-682 SINTEF
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33. |
Schjølberg-Henriksen, Kari; Ferber, Alain Marc C; Wang, Dag Thorstein; Moe, Sigurd T.; Schulz, O.; Lloyd, M.; Suphan, K-H.; Bernstein, R.W.; Rogne, H.; Müller, G.. Sensitive and Selective Photo Acoustic Gas Sensor Suitable for High Volume Manufacturing. IEEE Sensors Conference; 2006-10-25 SINTEF
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34. |
Schjølberg-Henriksen, Kari; Poppe, Erik; Moe, Sigurd T.; Storås, Preben; Taklo, Maaike Margrete Visser; Wang, Dag Thorstein; Jakobsen, Henrik. Anodic bonding of glass to aluminum. Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems 2006 ;Volum 12. s. 441-450 USN SINTEF NTNU
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35. |
Schjølberg-Henriksen, Kari; Wang, Dag Thorstein; Rogne, Henrik; Ferber, Alain Marc C; Vogl, Andreas; Moe, Sigurd T.; Bernstein, Ralph W.; Lapadatu, Daniel; Sandven, Knut; Brida, Sebastiano. High-resolution pressure sensor for photo acoustic gas detection. Sensors and Actuators A-Physical 2006 ;Volum 132. s. 207-213 SINTEF NTNU
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2004
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36. |
Hök, Bertil; Blückert, Anders; Dalsrud, Vegar; Gløersen, Per Gerhard; Jensen, Geir Uri; Lapadatu, Daniel; Vogl, Andreas; Wang, Dag Thorstein; Westgaard, Trond Inge; Åkerlund, Per; Østbø, Niels Peter. Scaling properties and MEMS implementation of acoustic gas sensors. Micro Structure Workshop 2004; 2004-03-30 - 2004-03-31 SINTEF
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37. |
Jakobsen, Henrik; Schjølberg-Henriksen, Kari; Poppe, Erik; Moe, S; Taklo, Maaike Margrete Visser; Wang, Dag Thorstein. Anodic bonding of glass to aluminium. Workshop on Wafer Bonding for MEMS; 2004-10-10 - 2004-10-12 USN
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2003
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38. |
Østbø, Niels Peter; Poppe, Erik; Tyholdt, Frode; Lecerf, Nicolas; Worren, Turid; Aukrust, Trond; Ræder, Henrik; Wang, Dag Thorstein. PZT thin films i MEMS. MST news 2003 (3) s. 15- UiO SINTEF
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2000
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39. |
Moe, Sigurd T.; Schjølberg-Henriksen, Kari; Wang, Dag Thorstein; Lund, E; Nysæther, J; Furuberg, Liv; Taklo, Maaike Margrete Visser; Fallet, Truls; Bernstein, R W. Capative Differential Pressure sensor for Harsh Environment. Sensors and Actuators A-Physical 2000 ;Volum 83.(1-3) s. 30-33 SINTEF
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40. |
Moe, Sigurd T.; Schjølberg-Henriksen, Kari; Wang, Dag Thorstein; Lund, Eivind; Nysæther, Jon Barratt; Furuberg, Liv; Taklo, Maaike Margrete Visser; Fallet, Truls; Bernstein, R. W.. Capacitive differential pressure sensor for harsh environments. Sensors and Actuators A-Physical 2000 ;Volum 83.(1-3) s. 30-33 UiO SINTEF
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41. |
Plaza, Jose Antonio; González, E.; Esteve, Jaume; Taklo, Maaike Margrete Visser; Wang, Dag Thorstein; Hanneborg, Anders Bror. Cathodic Debond of Anodically Bonded Silicon to Glass Wafers. Electrochemical and solid-state letters 2000 ;Volum 3.(8) s. 392- UiO SINTEF
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1999
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42. |
Taklo, Maaike Margrete Visser; Wang, Dag Thorstein; Moe, S. T.; Schjølberg-Henriksen, Kari; Hanneborg, Anders Bror. Pressure Sensor for Harsh Environments Realized by Triple-Stack Fusion Bonding. Fifth International Symposium on Semiconductor Wafer Bonding: Science, Technology and Applications; 1999-10-17 SINTEF UiO
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